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MediaTek has launched the Dimensity 8300 chipset – a power-efficient chipset designed for premium 5G smartphones. The SoC offers generative AI capabilities, adaptive gaming technology and fast connectivity. The chip will power 5G devices launching in the global market before the end of 2023.
MediaTek Dimensity 8300 chipset specs
The MediaTek launches Dimensity 8300 chipset is based on TSMC’s 2nd generation 4nm process.It has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture.
The company claims that the newest member of Dimensity 8000 SoC lineup offers 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset. It packs Mali-G615 MC6 GPU which is said to provide up to 60% greater performance and 55% better power efficiency.
“The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency,” Dr. Yenchi Lee, deputy general manager of MediaTek’s Wireless Communications Business Unit.
MediaTek Dimensity 8300 features
The MediaTek Dimensity 8300 come with full generative AI support facilitated by the APU 780 AI processor integrated into the chipset. This enables the SoC to provide support to developers to build applications that leverage large language models (LLMs) up to 10B, as well as stable diffusion.
The APU 780 features the same architecture as the flagship Dimensity 9300 SoCoffering a 3.3x boost in AI performance over the Dimensity 8200. The chipset also comes with MediaTek’s 14-bit HDR-ISP Imagiq 980 for photography and videography (up to 4K60 HDR).
MediaTek Dimensity 8300 gets HyperEngine adaptive game technology for advanced power savings enhancements, and 3GPP Release-16 standard 5G modem for fast internet speeds. Other features include MediaTek 5G UltraSave 3.0+ for improved 5G power efficiency and upgraded Wi-Fi 6E performance.
MediaTek Dimensity 8300 chipset specs
The MediaTek launches Dimensity 8300 chipset is based on TSMC’s 2nd generation 4nm process.It has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture.
The company claims that the newest member of Dimensity 8000 SoC lineup offers 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset. It packs Mali-G615 MC6 GPU which is said to provide up to 60% greater performance and 55% better power efficiency.
“The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency,” Dr. Yenchi Lee, deputy general manager of MediaTek’s Wireless Communications Business Unit.
MediaTek Dimensity 8300 features
The MediaTek Dimensity 8300 come with full generative AI support facilitated by the APU 780 AI processor integrated into the chipset. This enables the SoC to provide support to developers to build applications that leverage large language models (LLMs) up to 10B, as well as stable diffusion.
The APU 780 features the same architecture as the flagship Dimensity 9300 SoCoffering a 3.3x boost in AI performance over the Dimensity 8200. The chipset also comes with MediaTek’s 14-bit HDR-ISP Imagiq 980 for photography and videography (up to 4K60 HDR).
MediaTek Dimensity 8300 gets HyperEngine adaptive game technology for advanced power savings enhancements, and 3GPP Release-16 standard 5G modem for fast internet speeds. Other features include MediaTek 5G UltraSave 3.0+ for improved 5G power efficiency and upgraded Wi-Fi 6E performance.
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